Etch and Patterning Development for 2nm Node Nanosheet Devices
- Eric Miller
- Indira Seshadri
- et al.
- 2022
- SPIE Advanced Lithography 2022
Publications
Nanosheet Metrology Opportunities for Technology Readiness
- Mary Breton
- Daniel Schmidt
- et al.
- 2021
- SPIE Advanced Lithography 2021
Measuring Local CD Uniformity in EUV vias with scatterometry and machine learning
- Dexin Kong
- Daniel Schmidt
- et al.
- 2020
- SPIE Advanced Lithography 2020
Exploration of pillar local CDU improvement options for AI applications
- Charlie Liu
- Hao Tang
- et al.
- 2020
- SPIE Advanced Lithography 2020
Directed self-assembly of block copolymers for 7 nanometre FinFET technology and beyond
- Charlie Liu
- Elliott Franke
- et al.
- 2018
- Nature Electronics
Patents
Inverse Tone Pillar Printing Method Using Organic Planarizing Layer Pillars
- 10 Jul 2023
- US
- 11699592
Bottom Source/drain Etch With Fin-cut-last-vtfet
- 03 Jul 2023
- US
- 11695059
Euv Pattern Transfer Using Graded Hardmask
- 19 Jun 2023
- US
- 11681213
Fabrication Of Back-end-of-line Interconnects
- 19 Jun 2023
- US
- 11682558
Self-aligned Pattern Formation For A Semiconductor Device
- 08 May 2023
- US
- 11646221
Patterning Directly On An Amorphous Silicon Hardmask
- 24 Apr 2023
- JP
- 7268946
Patterning Material Film Stack With Metal-containing Top Coat For Enhanced Sensitivity In Extreme Ultraviolet (euv) Lithography
- 29 Jan 2023
- JP
- 7219278
Organic Photoresist Adhesion To Metal Oxide Hardmasks
- 02 Jan 2023
- US
- 11543751
Enabling Residue Free Gap Fill Between Nanosheets
- 28 Nov 2022
- US
- 11515431
Patterning Material Film Stack With Hard Mask Layer Configured To Support Selective Deposition On Patterned Resist Layer
- 14 Nov 2022
- US
- 11500293
Blog posts
EUV patterning yield breakthrough sets new benchmark for logic scaling
Technical noteNelson Felix and Luciana Meli4 minute read- AI Hardware
- Hardware Technology
- Logic Scaling
- Semiconductors
IBM Research at SPIE 2020: New architectures and fabrications for AI hardware
ResearchNelson Felix4 minute read- AI Hardware
- Semiconductors
Top collaborators
DM
Dominik Metzler
Advisory Engineer, BEOL RIE
MB
Mary Breton
Manager: Testsite Layout & Design
ST
Sidney Tsai
Manager, PRSM, Analog AI for Deep Learning Acceleration
SE
Sebastian Engelmann
RSM, Quantum System Components Lead