Novel ellipsometry-based machine learning technique for characterization of low sensitivity critical dimensions within gate-all-around transistors
- Houssam Chouaib
- Valeria Dimastrodonato
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Mary is currently serving as the Technical Assistant to Huiming Bu, Vice President of IBM Semiconductors Global R&D and Albany Operations, supporting various initiatives for the organization. Previously, Mary was the manager of the GRV, Macro Design, & Infrastructure group, a team focused on semiconductor R&D for next generation technology. While also a Technical Assistant, in some of her time she continues to lead enablement infrastructure projects and function as an enablement program manager.
Before her time in design, she was the manager of the inline metrology group, which explores a variety of electron, optical, magnetic, scanning, and x-ray based techniques for dimensional and material measurements. In her first IBM fulltime role as a metrology engineer, she was heavily involved in inline CDSEM, AFM, and scatterometry projects.
Mary's Bachelor of Science degree (S.B.) is from Massachusetts Institute of Technology (MIT) from the Department of Materials Science and Engineering (DMSE), where an interest in photovoltaics led her to the semiconductor industry. She received her Masters of Engineering (M.Eng) from Rensselaer Polytechnic Institute's (RPI's) Materials Science and Engineering (MSE) Department in 2017 and researched under Dr. Robert Hull. She was a summer metrology intern at IBM's East Fishkill site developing an algorithm to reduce model build time for scatterometry projects before joining IBM full-time.