What’s Next in Semiconductors
is 1 nanometer and beyond
Our chip-driven world owes much of its power and possibility to the semiconductor technologies pioneered at IBM. This legacy of innovation includes the first implementation of 7 nm and 5 nm process technologies, single cell DRAM, chemically amplified photoresists, copper interconnect wiring, silicon on insulator technology, high-k gate dielectrics, embedded DRAM, 3D chip stacking, and more. Today, we continue to push the limits of semiconductor design and packaging with inventions like the 2 nm node chip, vertical transistors, and nanosheet transistor technology.
Our work
How John Knickerbocker spent a career cultivating new technologies
Deep DivePeter HessHow low-precision computing boosts efficiency — without hurting accuracy
ExplainerPeter HessInside the lab testing some of the world’s most capable AI chips
Deep DiveMike MurphyCopper evolution and beyond: Developments in advanced interconnects for future CMOS nodes
Technical noteDechao Guo and Kisik ChoiRapidus and IBM move closer to scaling out 2 nm chip production
NewsPeter HessCo-packaged optics deliver high-speed connectivity to supercharge generative AI computing
NewsPeter Hess- See more of our work on Semiconductors
AI Hardware Center
The IBM Research AI Hardware Center is a global research collaboration hub dedicated to creating the next generation of systems and chips for AI workloads, as well as expanding joint research efforts across technology, architecture, and algorithms.