What’s Next in Semiconductors
is 1 nanometer and beyond

Chips power all our electronic devices, from computers and smartphones to medical equipment and automobiles. IBM continues to lead the industry in developing new designs and methods to make the semiconductors of the future smaller, faster, more energy efficient and reliable. We’re pushing the boundaries of logic scaling as well as chiplet technology and design, and with an ecosystem of partners, we’re moving innovations from our labs to the manufacturing line.

Overview

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IBM and Rapidus form strategic partnership

Rapidus, a newly-formed advanced logic company, will leverage IBM's semiconductor R&D leadership, including 2nm nanosheet CMOS, to build advanced semiconductor technology and an ecosystem in Japan.

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Our work

Publication collections

Analog AI Research chips used by IBM.

AI Hardware Center

The IBM Research AI Hardware Center is a global research collaboration hub dedicated to creating the next generation of systems and chips for AI workloads, as well as expanding joint research efforts across technology, architecture, and algorithms.

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Projects

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Advanced logic technology at 2nm node

Platform technology research: innovation and solution creation for leading edge CMOS technology at 2nm node.
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    Semiconductor fabrication & packaging

    We’re developing new materials for both the smallest length scale (<20nm) and largest length scale (>20mm) of semiconductor fabrication.
    • Materials Discovery
    • Accelerated Discovery

    Topics