What’s Next in Semiconductors
is 1 nanometer and beyond
Chips power all our electronic devices, from computers and smartphones to medical equipment and automobiles. IBM continues to lead the industry in developing new designs and methods to make the semiconductors of the future smaller, faster, more energy efficient and reliable. We’re pushing the boundaries of logic scaling as well as chiplet technology and design, and with an ecosystem of partners, we’re moving innovations from our labs to the manufacturing line.
Overview
Our work
What is chip packaging?
ExplainerMike Murphy- Semiconductors
A new chip architecture points to faster, more energy-efficient AI
NewsMike Murphy- AI
- AI Hardware
- Hybrid Cloud Infrastructure
What are semiconductors?
ExplainerMike Murphy- Semiconductors
IBM Research’s newest prototype chips use drastically less power to solve AI tasks
NewsMike Murphy- AI
- AI Hardware
- Semiconductors
IBM Research's latest analog AI chip for deep learning inference
NewsAbu Sebastian, Manuel Le Gallo-Bourdeau, and Vijay Narayanan- AI
- AI Hardware
- Semiconductors
Composable systems with OpenShift
Technical noteChristian Pinto, Michele Gazzetti, and Michael Johnston- Hybrid Cloud
- Hybrid Cloud Infrastructure
- See more of our work on Semiconductors
IBM and Rapidus form strategic partnership
Rapidus, a newly-formed advanced logic company, will leverage IBM's semiconductor R&D leadership, including 2nm nanosheet CMOS, to build advanced semiconductor technology and an ecosystem in Japan.
Publication collections
AI Hardware Center
The IBM Research AI Hardware Center is a global research collaboration hub dedicated to creating the next generation of systems and chips for AI workloads, as well as expanding joint research efforts across technology, architecture, and algorithms.