What’s Next in Semiconductors
is 1 nanometer and beyond
Our chip-driven world owes much of its power and possibility to the semiconductor technologies pioneered at IBM. This legacy of innovation includes the first implementation of 7 nm and 5 nm process technologies, single cell DRAM, chemically amplified photoresists, copper interconnect wiring, silicon on insulator technology, high-k gate dielectrics, embedded DRAM, 3D chip stacking, and more. Today, we continue to push the limits of semiconductor design and packaging with inventions like the 2 nm node chip, vertical transistors, and nanosheet transistor technology.
Our work
Building agents, brain-like chips, and tiny semiconductors
NewsMike Murphy and Peter HessIBM and Albany partners unlock new yield benchmarks for EUV patterning
Technical noteLuciana Meli and Nelson FelixBringing cloud-native AI supercomputing to a data center near you
Technical noteTalia Gershon, Yoonho Park, Nicole Saulnier, Daniel Klyashtorny, Jamey Roe, and Edward BarthThe chips of tomorrow may well take inspiration from the architecture of our brains
ExplainerPeter HessNew algorithms open possibilities for training AI models on analog chips
ResearchPeter HessFor LLMs, IBM’s NorthPole chip overcomes the tradeoff between speed and efficiency
ResearchPeter Hess- See more of our work on Semiconductors
IBM and Rapidus form strategic partnership
Rapidus, a newly-formed advanced logic company, will leverage IBM's semiconductor R&D leadership, including 2nm nanosheet CMOS, to build advanced semiconductor technology and an ecosystem in Japan.
Publication collections
AI Hardware Center
The IBM Research AI Hardware Center is a global research collaboration hub dedicated to creating the next generation of systems and chips for AI workloads, as well as expanding joint research efforts across technology, architecture, and algorithms.