Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
- Takeshi Nogami
- Oleg Gluschenkov
- et al.
- 2022
- VLSI Technology and Circuits 2022
Publications
A 72GS/s, 8-bit DAC-based Wireline Transmitter in 4nm FinFET CMOS for 200+Gb/s Serial Links
- Timothy Dickson
- Zeynep Deniz
- et al.
- 2022
- VLSI Technology and Circuits 2022
An 8-bit 56GS/s 64x Time-Interleaved ADC with Bootstrapped Sampler and Class-AB Buffer in 4nm CMOS
- A. Serdar Yonar
- Pier Andrea Francese
- et al.
- 2022
- VLSI Technology and Circuits 2022
Asymmetric Double-Gate Ferroelectric FET to Decouple the Tradeoff Between Thickness Scaling and Memory Window
- Zhouhang Jiang
- Yi Xiao
- et al.
- 2022
- VLSI Technology and Circuits 2022
A 0.31V Vmin Cryogenic SRAM in 14 nm FinFET for Quantum Computing
- Rajiv V. Joshi
- J. Timmerwilke
- et al.
- 2022
- VLSI Technology and Circuits 2022
Group Signatures and More from Isogenies and Lattices: Generic, Simple, and Efficient
- Ward Beullens
- Samuel Dobson
- et al.
- 2022
- Eurocrypt 2022
Practical Non-interactive Publicly Verifiable Secret Sharing with Thousands of Parties
- Craig Gentry
- Shai Halevi
- et al.
- 2022
- Eurocrypt 2022
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- Prabudhya Roy Chowdhury
- Katsuyuki Sakuma
- et al.
- 2022
- ECTC 2022
Zero-Knowledge IOPs with Linear-Time Prover and Polylogarithmic-Time Verifier
- Jonathan Bootle
- Alessandro Chiesa
- et al.
- 2022
- Eurocrypt 2022
Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
- Frank Libsch
- Hiroyuki Mori
- et al.
- 2022
- ECTC 2022