Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- Prabudhya Roy Chowdhury
- Sathya Raghavan
- et al.
- ECTC 2023
Katsuyuki Sakuma is a Principal Research Staff Member, a Research Manager, and an IBM Master Inventor at the IBM T. J. Watson Research Center. He is also a Visiting Professor in the Department of Biomedical Engineering, Tohoku University, Japan, and previously at National Chiao Tung University, Taiwan. His research interests include 3D integration technologies, bonding technologies, advanced packaging, and biomedical engineering.
He has published more than 100 peer-reviewed journal papers and conference proceeding papers, including five book chapters. He also holds more than 80 issued or pending U.S. and international patents. He has been recognized with the IBM 20th Invention Achievement Award in 2022 and an Outstanding Technical Achievement Award (OTAA) in 2015. He was also given the 2018 Exceptional Technical Achievement Award from IEEE Electronics Packaging Society and the 2017 Alumni Achievement Award from his Alma Mater, the School of Engineering at Tohoku University, for his exceptional contribution to 3D chip stack technology development in the global microelectronics packaging industry. He was co-recipient of IEEE CPMT Japan Society Best Presentation Award in 2012, and the IMAPS Best Paper Award of the interactive poster session in 2015.
He received his B.S. and M.S. degrees from Tohoku University, respectively, and the Ph.D. degree from Waseda University, Japan. He has been a senior member of IEEE and a member of the Japan Society of Applied Physics (JSAP). He has served as a committee member of the IEEE ECTC sub-committee since 2012, for the IEEE 3DIC technical program committee since 2016, and for the IEEE IRPS since 2017.
-IEEE Transactions on Components, Packaging and Manufacturing Technology (CPMT) (2016 - present )
-Institute of Electronics, Information and Communication Engineers (IEICE) (2003 -- 2005)
Technical Committee Chair
-IEEE Electronic Components and Technology Conference (ECTC) (2016, 2017)
Technical Committee Member
-IEEE Electronic Components and Technology Conference (ECTC) (2012 - present )
-IEEE International 3D Systems Integration Conference (3DIC) (2016 - present )
-IEEE International Reliability Physics Symposium (IRPS) (2017 - 2019)
Honors and Awards
-2022 IEEE Electronics Packaging Society, 10-year ECTC Service Award
-2022 IBM, 20th Invention Plateau
-2018 Visiting Professor, National Chiao Tung Univ, Taiwan
-2018 IEEE Electronics Packaging Society, Exceptional Technical Achievement Award
-2018-present Visiting Professor, Tohoku Univ. Japan
-2017 The School of Engineering at Tohoku University, Alumni Achievement Award
-2015 IMAPS, Best of Track
-2015 IBM, Outstanding Technical Achievement Award
-2013 IEEE Semiconductor wafer test workshop, Best Data Presentation
-2012 IEEE CPMT Japan Society, Best Presentation Award
-2012 IBM Material Research Community, Best Paper Award Runners-up