Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate

Abstract

The focus of this work encompasses signal integrity (SI) design and analysis in hybrid integration of the latest generation of High Bandwidth Memory (HBM2E) onto the latest generation high density Organic Package now capable of 1.5um line and space interconnects. In this paper, for the first time, we design and analyze the whole system HBM2E link budget components on latest generation high density Organic Package where the methodology details all the interconnect signal uncertainties.