Publications

155 results for Thomas Brunschwiler

Modeling and multi-objective optimization of 2.5D inductor-based Fully Integrated Voltage Regulators for microprocessor applications
- - Pedro André Martins Bezerra
  - Florian Krismer
  - et al.
- 2015
- COBEP/SPEC 2015
A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study
- - Chander Shekhar Sharma
  - Gerd Schlottig
  - et al.
- 2015
- Int. J. Heat Mass Transf.
Enhanced thermal underfills by bridging nanoparticle assemblies in percolating microparticle beds
- - Jonas Zürcher
  - Xi Chen
  - et al.
- 2015
- NANO 2015
Embedded power insert enabling dual-side cooling of microprocessors
- - Thomas Brunschwiler
  - Dominic Gschwend
  - et al.
- 2015
- ECTC 2015
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
- - Jonas Zürcher
  - Kerry Yu
  - et al.
- 2015
- ECTC 2015
Thermal design of a hierarchical radially expanding cavity for two-Phase cooling of integrated circuits
- - Arvind Sridhar
  - Chin Lee Ong
  - et al.
- 2015
- InterPACK 2015
Benchmarking study on the thermal management landscape for 3D ICS: from back-side to volumetric heat removal
- - Thomas Brunschwiler
  - Arvind Sridhar
  - et al.
- 2015
- InterPACK 2015
LID-integral cold plate topology integration, performance, and reliability
- - Gerd Schlottig
  - Marco De Fazio
  - et al.
- 2015
- InterPACK 2015
Advances in percolated thermal underfill (PTU) simulations for 3D-integration
- - Sridhar Kumar
  - Uwe Zschenderlein
  - et al.
- 2015
- EuroSimE 2015
Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects
- - Christian Hofmann
  - Mario Baum
  - et al.
- 2015
- SSI 2015