Publications

155 results for Thomas Brunschwiler

A multivariate parameter analysis of copper pillars eases the design of denser interconnects
- - Gerd Schlottig
  - Thomas Brunschwiler
  - et al.
- 2012
- EuroSimE 2012
Energy-efficient multiobjective thermal control for liquid-cooled 3-D stacked architectures
- - Mohamed M. Sabry
  - Ayse K. Coskun
  - et al.
- 2011
- IEEE TCADIS
Formulation of percolating thermal underfill by sequential convective gap filling
- - Thomas Brunschwiler
  - Javier V. Goicochea
  - et al.
- 2011
- ISHVAC 2011
Toward five-dimensional scaling: How density improves efficiency in future computers
- - Patrick W. Ruch
  - Thomas Brunschwiler
  - et al.
- 2011
- IBM J. Res. Dev
Surface-tension-driven multi-chip self-alignment techniques for heterogeneous 3D integration
- - Fengda Sun
  - Yusuf Leblebici
  - et al.
- 2011
- ECTC 2011
Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
- - Thomas Brunschwiler
  - Stephan Paredes
  - et al.
- 2011
- SEMI-THERM 2011
Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics
- - Adrian Renfer
  - Manish K. Tiwari
  - et al.
- 2011
- Experiments in Fluids
On the cooling of electronics with nanofluids
- - W. Escher
  - Thomas Brunschwiler
  - et al.
- 2011
- Journal of Heat Transfer
Pin-shape assessment for interlayer-cooled chip stacks with periodic boundary condition modeling
- - Gözde Töral
  - Roland Bender
  - et al.
- 2010
- THERMINIC 2010
Direct waste heat utilization from liquid-cooled supercomputers
- - Thomas Brunschwiler
  - Gerhard Ingmar Meijer
  - et al.
- 2010
- IHTC 2010