Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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61 results for Cornelia Tsang

CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- - Bing Dang
  - Paul Andry
  - et al.
- 2010
- ECTC 2010
IMC bonding for 3D interconnection
- - Katsuyuki Sakuma
  - Kuniaki Sueoka
  - et al.
- 2010
- ECTC 2010
Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects
- - Fuad E. Doany
  - Benjamin G. Lee
  - et al.
- 2010
- ECTC 2010
Die-to-wafer 3D integration technology for high yield and throughput
- - Katsuyuki Sakuma
  - Paul S. Andry
  - et al.
- 2008
- MRS Fall Meeting 2008
3D silicon integration
- - J. Knickerbocker
  - P. Andry
  - et al.
- 2008
- ECTC 2008
300-Gb/s 24-channel bidirectional Si carrier transceiver optochip for board-level interconnects
- - Fuad E. Doany
  - Clint L. Schow
  - et al.
- 2008
- ECTC 2008
50μm pitch Pb-free micro-bumps by C4NP technology
- - Bing Dang
  - Da-Yuan Shih
  - et al.
- 2008
- ECTC 2008
Characterization of stacked die using die-to-wafer integration for high yield and throughput
- - K. Sakuma
  - P. Andry
  - et al.
- 2008
- ECTC 2008
3D chip stacking technology with low-volume lead-free interconnections
- - K. Sakuma
  - P. Andry
  - et al.
- 2007
- ECTC 2007
Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- - B. Dang
  - S.L. Wright
  - et al.
- 2007
- ECTC 2007