Conference paper

01 Dec 2011

Evaluation of electrodeposited photoresists for use in the fabrication of an optochip silicon interposer

Abstract

No abstract available.

Related

Paper

Terabit/s-class optical PCB links incorporating 360-Gb/s bidirectional 850 nm parallel optical transceivers

Conference paper

IMC bonding for 3D interconnection

Conference paper

Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects

Conference paper

24-Channel optical transceiver module for waveguide-on-card interconnects

View all publications