Benchmarking Power Delivery Network Designs at the 5-nm Technology Node
- Nicholas A. Lanzillo
- Albert M. Chu
- et al.
- 2021
- IEEE T-ED
Publications
64 results for Nick Lanzillo
Power Delivery Design, Signal Routing, and Performance of On-Chip Cobalt Interconnects in Advanced Technology Nodes
- Nicholas A. Lanzillo
- Albert Chu
- et al.
- 2021
- IEEE Transactions on VLSI Systems
Electromigration and Line R of Graphene Capped Cu Dual Damascene Interconnect
- T. Nogami
- S. Nguyen
- et al.
- 2021
- IEDM 2021
Dual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- P. Bhosale
- N. Lanzillo
- et al.
- 2021
- VLSI Technology 2021
Additive Lithography - Organic Monolayer Patterning Coupled with an Area-Selective Deposition
- Rudy Wojtecki
- Jonathan Ma
- et al.
- 2021
- ACS AMI
Topological semimetals for scaled back-end-of-line interconnect beyond Cu
- Ching-Tzu Chen
- Utkarsh Bajpai
- et al.
- 2020
- IEDM 2020
Interconnect scaling challenges, and opportunities to enable system-level performance beyond 30 nm pitch
- Griselda Bonilla
- Nicholas A. Lanzillo
- et al.
- 2020
- IEDM 2020
Comprehensive BEOL Performance Assessment: Interconnects Optimized for Signal Routing and Power Delivery in Advanced CMOS Technology Nodes (Invited)
- Nicholas A. Lanzillo
- Rwik Sengupta
- et al.
- 2020
- IITC 2020
Role of high aspect-ratio thin-film metal deposition in Cu back-end-of-line technology
- Andrew Simon
- O. Van Der Straten
- et al.
- 2020
- JVSTA
Composite Interconnects for High-Performance Computing beyond the 7nm Node
- P. Bhosale
- S. Parikh
- et al.
- 2020
- VLSI Technology 2020