Publication
IEDM 2020
Conference paper

Interconnect scaling challenges, and opportunities to enable system-level performance beyond 30 nm pitch

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Abstract

On-chip interconnects are fundamental to semiconductor functionality. We discuss the scaling challenges and opportunities to continue to offer increased system performance, especially as computing systems become heterogeneous. Continued focus must shift from traditional scaling and device performance towards providing the high interconnectivity needed to support heterogeneous systems.

Date

12 Dec 2020

Publication

IEDM 2020

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