Ruqiang Bao, Reinaldo A. Vega, et al.
IEDM 2019
We analyze the impact of interconnect resistance on power delivery network performance using circuit-level simulation for beyond 7 nm technology nodes. We assess the impact of alternate conductors on wide line delay and find between 10-20% performance penalty relative to Cu. In addition, we assess the performance impact of a backside power rail (BPR) and find up to a 25% reduction in delay at a fixed power tap spacing, or equivalently a 1.5x increase in power tap spacing at a fixed voltage (IR) drop. We find that IR drop along power lines can vary from ~10 mV to ~100 mV depending on power tap frequency, inverter drive strength and activity factor.
Ruqiang Bao, Reinaldo A. Vega, et al.
IEDM 2019
C. J. Penny, Koichi Motoyama, et al.
IEDM 2022
P. Bhosale, S. Parikh, et al.
VLSI Technology 2020
P. Bhosale, J. Maniscalco, et al.
IITC 2018