Publication
IEDM 2020
Conference paper

Topological semimetals for scaled back-end-of-line interconnect beyond Cu

Download paper

Abstract

The resistance bottleneck in metal-interconnect scaling calls for new interconnect materials. This paper explores topological semimetals as a potential solution. After reviewing the desirable properties of topological semimetals for back-end-of-line (BEOL) interconnects, we use CoSi as an example to demonstrate the decreasing resistance-area product with scaling and provide material-search guidelines.

Date

12 Dec 2020

Publication

IEDM 2020

Authors

Tags

Resources

Share