Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- Chris Penny
- Koichi Motoyama
- et al.
- 2022
- IEDM 2022
Publications
This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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Year
11 results for Nick Lanzillo
Resistivity scaling in topological semimetal CoSi
- Hsin Lin
- Shang-Wei Lien
- et al.
- 2022
- APS March Meeting 2022
Electromigration and Line R of Graphene Capped Cu Dual Damascene Interconnect
- Takeshi Nogami
- Son Nguyen
- et al.
- 2021
- IEDM 2021
Exploring Topological Semimetals for Highly Scaled Interconnects Beyond Copper
- Ching-Tzu Chen
- Christian Lavoie
- et al.
- 2023
- MRS Spring Meeting 2023
Unconventional Resistivity Scaling in Topological Semimetal CoSi
- Hsin Lin
- Shang-Wei Lien
- et al.
- 2023
- MRS Spring Meeting 2023
Unconventional resistivity scaling in topological semimetal CoSi
- Hsin Lin
- Shang-Wei Lien
- et al.
- 2023
- APS March Meeting 2023
Exploring Unconventional Resistivity Scaling in Topological Semimetals for Interconnects Beyond Copper
- Ching-Tzu Chen
- Christian Lavoie
- et al.
- 2023
- APS March Meeting 2023
Evaluating the Potential of Weyl Semimetals as Future Interconnect Metals
- Sushant Kumar
- Yi-Hsin Tu
- et al.
- 2022
- MRS Spring Meeting 2022
Next-Generation Logic Design Architecture for Vertical-Transport Nanosheets
- Biswanath (Biswa) Senapati
- Jeongho Do
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Area-Selective Deposition of Tantalum Nitride with Polymerizable Monolayers: From Liquid to Vapor Phase Inhibitors
- Krystelle Lionti
- Noel Arellano
- et al.
- 2022
- Chemistry of Materials