Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- Son Nguyen
- Huai Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Publications
64 results for Nick Lanzillo
NanoStack Transistor Architecture for CMOS 7A Node and Beyond
- Shay Reboh
- Chen Zhang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Monolithic Stacked FET with Stepped Channels for Future Logic Technologies
- Chen Zhang
- Seungmin Song
- et al.
- 2024
- IEDM 2024
Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- Koichi Motoyama
- Jaemyung Choi
- et al.
- 2024
- IEDM 2024
The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- Daniel Edelstein
- Son Nguyen
- et al.
- 2024
- IEDM 2024
Backside power distribution for nanosheet technologies beyond 2nm
- Ruilong Xie
- Wonhyuk Hong
- et al.
- 2024
- VLSI Technology and Circuits 2024
DTCO Guided Process Integration: Case Studies From FEOL & BEOL with BSPDN
- Minhaz Abedin
- Shahrukh Khan
- et al.
- 2024
- ASMC 2024
DTCO Guided Process Integration: Case Studies from FEOL & BEOL with BSPDN Topic: DTCO/DFM
- Minhaz Abedin
- Shahrukh Khan
- et al.
- 2024
- ASMC 2024
Surface-dominated conductance scaling in Weyl semimetal NbAs
- Sushant Kumar
- Yi-Hsin Tu
- et al.
- 2024
- npj Computational Materials
Topological semimetal interface resistivity scaling for vertical interconnect applications
- Nicholas A. Lanzillo
- Utkarsh Bajpai
- et al.
- 2024
- Applied Physics Letters