Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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8 results for Nick Lanzillo

Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- - Chris Penny
  - Koichi Motoyama
  - et al.
- 2022
- IEDM 2022
Resistivity scaling in topological semimetal CoSi
- - Hsin Lin
  - Shang-Wei Lien
  - et al.
- 2022
- APS March Meeting 2022
Electromigration and Line R of Graphene Capped Cu Dual Damascene Interconnect
- - Takeshi Nogami
  - Son Nguyen
  - et al.
- 2021
- IEDM 2021
Unconventional resistivity scaling in topological semimetal CoSi
- - Hsin Lin
  - Shang-Wei Lien
  - et al.
- 2023
- APS March Meeting 2023
Exploring Unconventional Resistivity Scaling in Topological Semimetals for Interconnects Beyond Copper
- - Ching-Tzu Chen
  - Christian Lavoie
  - et al.
- 2023
- APS March Meeting 2023
Evaluating the Potential of Weyl Semimetals as Future Interconnect Metals
- - Sushant Kumar
  - Yi-Hsin Tu
  - et al.
- 2022
- MRS Spring Meeting 2022
Area-Selective Deposition of Tantalum Nitride with Polymerizable Monolayers: From Liquid to Vapor Phase Inhibitors
- - Krystelle Lionti
  - Noel Arellano
  - et al.
- 2022
- Chemistry of Materials
Additive Lithography - Organic Monolayer Patterning Coupled with an Area-Selective Deposition
- - Rudy Wojtecki
  - Jonathan Ma
  - et al.
- 2021
- ACS AMI