Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Year

33 results for Chiplets

CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
- - Risa Miyazawa
  - Hiroyuki Mori
  - et al.
- 2023
- iTHERM 2023
TSV Stress Evolution Mapping using in-line Raman Spectroscopy
- - Stefan Schoeche
  - Daniel Schmidt
  - et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Detection of printable EUV mask absorber defects and defect adders by full chip optical inspection of EUV patterned wafers
- - Luciana Meli
  - Scott D. Halle
  - et al.
- 2016
- ASMC 2016
Warpage analysis of organic substrates for 2.1D packaging
- - Sayuri Kohara
  - Keishi Okamoto
  - et al.
- 2015
- 3DIC 2015
Essential edge protection techniques for successful multi-wafer stacking
- - Joshua Rubin
  - Kevin Winstel
  - et al.
- 2015
- S3S 2015
Advances in percolated thermal underfill (PTU) simulations for 3D-integration
- - Sridhar Kumar
  - Uwe Zschenderlein
  - et al.
- 2015
- EuroSimE 2015
Evolution of patterning materials towards the Moore's Law 2.0 Era
- - Dario L. Goldfarb
- 2022
- Japanese Journal of Applied Physics
Innovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- - Griselda Bonilla
- 2023
- iTHERM 2023
Interconnects for DNA, Quantum, In-Memory, and Optical Computing: Insights From a Panel Discussion
- - Amlan Ganguly
  - Sergi Abadal
  - et al.
- 2021
- IEEE Micro
Co-package technology platform for low-power and low-cost data centers
- - Konstantinos Papatryfonos
  - David R. Selviah
  - et al.
- 2021
- Applied Sciences