Modeling of heterojunction HgCdTe photodiodes using approximate k · p approach
- V. Ariel
- G. Bahir
- 1997
- Journal of Electronic Materials
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Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices
- Luca Del Carro
- Alfred A. Zinn
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- 2019
- Journal of Electronic Materials
Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films
- Jaewon Chang
- Sung K. Kang
- et al.
- 2015
- Journal of Electronic Materials
Effects of sodium citrate concentration on electroless Ni-Fe bath stability and deposition
- Myung-Won Jung
- Sung K. Kang
- et al.
- 2013
- Journal of Electronic Materials
Investigation of Sn whisker growth in electroplated Sn and Sn-Ag as a function of plating variables and storage conditions
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- Sung K. Kang
- et al.
- 2013
- Journal of Electronic Materials
Measurement of thermoelectric properties of single semiconductor nanowires
- Siegfried Karg
- Philipp Mensch
- et al.
- 2013
- Journal of Electronic Materials
Investigation and effects of wafer bow in 3D integration bonding schemes
- K.N. Chen
- Y. Zhu
- et al.
- 2010
- Journal of Electronic Materials
The crystal orientation of β-Sn grains in Sn-Ag and Sn-Cu solders affected by their interfacial reactions with Cu and Ni(P) under bump metallurgy
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2009
- Journal of Electronic Materials
Interfacial reactions and microstructures of Sn-0.7Cu-xZn solders with ni-P UBM during thermal aging
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2009
- Journal of Electronic Materials
An investigation of microstructure and microhardness of Sn-Cu and Sn-Ag solders as functions of alloy composition and cooling rate
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2008
- Journal of Electronic Materials