OpenCAPI memory interface signal integrity study for high-speed DDR5 differential DIMM channel with standard loss FR-4 material and SNIA SFF-TA-1002 connectorBiao CaiJose Hejaseet al.2019ECTC 2019
A wearable fingernail deformation sensing system and three-dimensional finite element model of fingertipKatsuyuki SakumaBucknell Webbet al.2019ECTC 2019
Vertical interconnect technology for enlarging capacity on micro solid thin film rechargeable batteryAkihiro HoribeKuniaki Sueokaet al.2019ECTC 2019
Flip-chip III-V-to-silicon photonics interfaces for optical sensorYves MartinJason S. Orcuttet al.2019ECTC 2019
Study of design optimization method for ultra-low power micro gas sensorEiji NakamuraKeiji Matsumotoet al.2019ECTC 2019
Novel packaging structure and processes for micro-TFB (thin film battery) to enable miniaturized healthcare internet-of-things (IoT) devicesBing DangQianwen Chenet al.2019ECTC 2019
Service Placement with Provable Guarantees in Heterogeneous Edge Computing SystemsStephen PasterisShiqiang Wanget al.2019INFOCOM 2019
SADeepSense: Self-Attention Deep Learning Framework for Heterogeneous On-Device Sensors in Internet of Things ApplicationsShuochao YaoYiran Zhaoet al.2019INFOCOM 2019
Looking Glass of NFV: Inferring the Structure and State of NFV Network from External ObservationsYilei LinTing Heet al.2019INFOCOM 2019
Experiences Implementing Live VM Migration over the WAN with Multi-Path TCPFranck LeErich Nahum2019INFOCOM 2019