Publication
ECTC 2019
Conference paper

Vertical interconnect technology for enlarging capacity on micro solid thin film rechargeable battery

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Abstract

A vertical interconnect technology for stacking micro solid thin film batteries (STFB) in IoT devices is proposed. This technology consists of stacking glass substrates with a layer of solid thin film battery, drilling by laser machining, filling the holes with solder to connect the stacked batteries, and dicing the stacked wafer to 1×1 mm micro stacked batteries. In this work, various metals are evaluated to identify the appropriate electrode drilled with glass and resin. The effects of the laser wavelength are also investigated.

Date

01 May 2019

Publication

ECTC 2019

Authors

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