Publications

241 results for Hardware Technology

Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- - Toyohiro Aoki
  - Katsuyuki Sakuma
  - et al.
- 2023
- ECTC 2023
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- - Katsuyuki Sakuma
  - Griselda Bonilla
  - et al.
- 2023
- ECTC 2023
Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- - Shrivani Pandiya
  - Serge Ecoffey
  - et al.
- 2023
- ECTC 2023
1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- - Hussein Hamieh
  - Juliano Borges
  - et al.
- 2023
- ECTC 2023
Voids-free Die-level Cu/ILD Hybrid bonding
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2023
- ECTC 2023
High Density Photonic Reservoir Computing using Optical Fiber and Polymer Waveguide
- - Hidetoshi Numata
  - Toshiyuki Yamane
  - et al.
- 2023
- ECTC 2023
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- - Juliano Borges
  - Maxime Darnon
  - et al.
- 2023
- ECTC 2023
Innovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- - Griselda Bonilla
- 2023
- iTHERM 2023
Module, antenna, and package design considerations for mm-scale IoT devices
- - Arun Paidimarri
  - Duixian Liu
  - et al.
- 2023
- ECTC 2023
Stochastic magnetic tunnel junction with easy-plane dominant anisotropy
- - Jonathan Z. Sun
  - Christopher Safranski
  - et al.
- 2023
- Physical Review B