Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Year

131 results for Hardware Technology

Improving NAND flash performance with read heat separation
- - Roman Pletka
  - Nikolaos Papandreou
  - et al.
- 2020
- MASCOTS 2020
Neural Network Accelerated Implicit Filtering: Integrating Neural Network Surrogates With Provably Convergent Derivative Free Optimization Methods
- - Eldad Haber
  - Brian Irwin
  - et al.
- 2023
- ICML 2023
High Density Photonic Reservoir Computing using Optical Fiber and Polymer Waveguide
- - Hidetoshi Numata
  - Toshiyuki Yamane
  - et al.
- 2023
- ECTC 2023
Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)
- - Hafiz Wakas Ali
  - David Danovitch
  - et al.
- 2023
- ECTC 2023
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- - Aakrati Jain
  - Sathya Raghavan
  - et al.
- 2023
- ECTC 2023
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- - Duixian Liu
  - Xiaoxiong Gu
  - et al.
- 2023
- ECTC 2023
A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning
- - Sathya Raghavan
  - Aakrati Jain
  - et al.
- 2023
- ECTC 2023
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- - Toyohiro Aoki
  - Hiroyuki Mori
  - et al.
- 2023
- ECTC 2023
Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- - Shrivani Pandiya
  - Serge Ecoffey
  - et al.
- 2023
- ECTC 2023
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- - Juliano Borges
  - Maxime Darnon
  - et al.
- 2023
- ECTC 2023