Optical high speed symmetric multi-processor link implementation
Daniel Kuchta, Christian Baks, et al.
ECTC 2006
This paper presents a study of antennas and package options for mm-scale Internet-of-Things (IoT) applications. Specifically, silicon interposer and organic package substrates with areas ranging from 2.12.1mm to 65mm are explored. The antennas are electrically-small loop and dipole antennas operating at 900MHz and 5.8GHz in the sub-6GHz bands; and dipole antennas operating in the 28GHz mm-wave band. The antennas are designed in the context of small sub-mm integrated circuits. We find that both silicon interposer and organic package substrates can achieve similar antenna performances across frequencies even though they have different constraints. Our system analysis shows that for a given EIRP limit, 28GHz achieves the highest range for smaller 2.12.1mm substrates.
Daniel Kuchta, Christian Baks, et al.
ECTC 2006
Hazar Yueksel, Ramon Bertran, et al.
MLSys 2020
Jinghan Huang, Hyungyo Kim, et al.
MICRO 2025
Benjamin G. Lee, Renato Rimolo-Donadio, et al.
OFC 2015