A Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications
- Aakrati Jain
- Kamal Sikka
- et al.
- 2022
- ECTC 2022
Publications
Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
- Frank Libsch
- Hiroyuki Mori
- et al.
- 2022
- ECTC 2022
Surface Energy Characterization for Die-Level Cu Hybrid Bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2022
- ECTC 2022
Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2022
- ECTC 2022
Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2022
- ECTC 2022
Practical Non-interactive Publicly Verifiable Secret Sharing with Thousands of Parties
- Craig Gentry
- Shai Halevi
- et al.
- 2022
- Eurocrypt 2022
Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022
Sine Series Approximation of the Mod Function for Bootstrapping of Approximate HE
- Charanjit Jutla
- Nathan Manohar
- 2022
- Eurocrypt 2022
Quality Controlled Paraphrase Generation
- Elron Bandel
- Ranit Aharonov
- et al.
- 2022
- ACL 2022
On The Ingredients of an Effective Zero-shot Semantic Parser
- Pengcheng Yin
- John Wieting
- et al.
- 2022
- ACL 2022