Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
- Jae-Woong Nah
- Michael Gaynes
- et al.
- 2012
- ECTC 2012
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22 results for Eric Perfecto
A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid cu-adhesive bonding
- F. Liu
- R.R. Yu
- et al.
- 2008
- IEDM 2008
Reliable Cu Pillar Undercut Control Using the Endpoint Detection System
- Zachary Gardner
- Soon-Cheon Seo
- et al.
- 2024
- ASMC 2024
Design and process development concerns for the assembly of very small solder joints
- A. Alazzam
- M. Obaidat
- et al.
- 2012
- IMECE 2012
Assessment of XRF technique as a method to measure percent ag in SnAg solders for flip chip applications
- Jennifer D. Schuler
- Chia-Hsin Shih
- et al.
- 2012
- IMAPS 2012
Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding
- R.R. Yu
- F. Liu
- et al.
- 2009
- VLSI Technology 2009
Chip to carrier C4 technology challenges with Pb-free solders
- Eric D. Perfecto
- Brian Sundlof
- et al.
- 2008
- CICC 2008
C4NP technology: Present and future
- Eric Perfecto
- Da-Yuan Shih
- et al.
- 2008
- GBC 2008
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008
Large format fabrication a practical approach to low cost MCM-d
- George E. White
- Eric Perfecto
- et al.
- 1994
- MCMC 1994