Large format fabrication a practical approach to low cost MCM-d

Abstract

The IBM Microelectronics Division at East Fishkill has recently demonstrated the fabrication of thin films for MCM-D on large area panels, 300 mm x 300 mm in size. Fabrication of the thin films was acconplished on IBM's 300 mm development line using immersion development of photosensitive polyimide for via formation and electrolytic plating to define wiring and terminal metal levels. One plane pair of thin films was constructed on Corning glass 7059 panels for 35 micron lines on 85 micron pitch. In addition, two metal-dielectric levels with 13 urn lines on 25 um pitch has also been demonstrated. The 25 urn pitch represents the most aggressive groundrule practiced in electronic packaging today. The successful production of electrically good substrates at a high yield from a 300 mm panel provides a gateway to significant cost reductions of future MCM-D products from IBM. In this paper we will discuss the processes and equipment used to fabricate two different test vehicles, as well as some of cost and yield considerations associated with large area panel processing for MCM-D packages.