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Publication
IMAPS 2012
Conference paper
Assessment of XRF technique as a method to measure percent ag in SnAg solders for flip chip applications
Abstract
Pb-free SnAg solder has become the industry standard for fabricating flip chip interconnects utilizing C4 (controlled collapse chip connection) technology. One area of interest for manufacturability of Pb-free solders is the ability to control and measure the %Ag composition and its variation from wafer to wafer, chip to chip, and C4 to C4.