Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- Qianwen Chen
- Michael Belyansky
- et al.
- 2023
- ECTC 2023
Publications
Date
Featured collections
Popular topics
20 results for Eric Perfecto
Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022
Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2016
- ECTC 2016
Defect mitigation of plasma-induced delamination of TiW/Cu from SiNx layer in thin si interposer processing with glass carriers
- Vijay Sukumaran
- Thuy Tran-Quinn
- et al.
- 2015
- ECTC 2015
Effect of Ag and Cu content in Sn based Pb-free solder on electromigration
- Minhua Lu
- Charles Goldsmith
- et al.
- 2014
- ECTC 2014
Wafer IMS (Injection molded solder) - A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
- Jae Woong Nah
- Jeffrey Gelorme
- et al.
- 2014
- ECTC 2014
Bonding technologies for chip level and wafer level 3D integration
- Katsuyuki Sakuma
- Spyridon Skordas
- et al.
- 2014
- ECTC 2014
Controlling the Sn grain morphology of SnAg C4 solder bumps
- Gregory Parks
- Minhua Lu
- et al.
- 2014
- ECTC 2014
The dependence of the Sn grain structure of Pb-free solder joints on composition and geometry
- Gregory Parks
- Babak Arfaei
- et al.
- 2012
- ECTC 2012
Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
- Jae-Woong Nah
- Michael Gaynes
- et al.
- 2012
- ECTC 2012