ECTC 2013
Conference paper

Thermally enhanced pre-applied underfills for 3D integration

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One of the biggest challenges for future high-performance three dimensional (3D) integrated devices is heat removal from the stacked dies. In this study, thermally enhanced pre-applied type underfills were studied. These materials were formulated considering fillet cracks and delaminations that appeared in thermal cycling tests on 2D organic package. Finally, the applicability for 3D integration processing with the new material was evaluated on a 3D test vehicle assembly. © 2013 IEEE.