Injection Molded Solder (IMS) is an advanced solder bumping technology that the solder bumps can be made by injected pure molten solder through the masks. In this study, 3 different sizes of bumps were fabricated by IMS with PI film mask. 3 different solder types, Sn-Ag-Cu, Sn-Bi, and In-Sn were selected for this study. Firstly, effects of IMS stage temperature on bump mechanical integrity for Sn-Ag-Cu were evaluated by bump shear and cross-sectional IMC observation. It was found that higher temperature produced scalloped Cu 6Sn5 IMC at the interface, however lower temperatures produced planar Cu6Sn5 IMC. The bumps fabricated with a lower temperature were subjected to thermal aging, and characterized by shear test and cross-sectional IMC observation. No interfacial failure was observed before and after aging, and shear fracture modes for all bumps were ductile. In addition, lower melting point solders Sn-Bi and In-Sn were subjected to aging, and no interfacial failure was found. Changes in shear strength after aging are dependent on the microstructure at the shear height.