Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates
- Katsuyuki Sakuma
- Edmund Blackshear
- et al.
- 2013
- ECTC 2013
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13 results at ECTC 2013
Thermally enhanced pre-applied underfills for 3D integration
- Akihiro Horibe
- Keishi Okamoto
- et al.
- 2013
- ECTC 2013
NiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50μm pitch in 3D chip stacks
- Bing Dang
- Steven Wright
- et al.
- 2013
- ECTC 2013
Realization of ultra-low power I/O
- Lei Shan
- Timothy Dickson
- et al.
- 2013
- ECTC 2013
High-speed signaling performance of multilevel wiring on glass substrates for 2.5-D integrated circuit and optoelectronic integration
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2013
- ECTC 2013
Optical packaging of silicon photonic devices for external connection of parallel optical signals
- Yoichi Taira
- Hidetoshi Numata
- 2013
- ECTC 2013
Enhanced multilayer organic packages with embedded phased-array antennas for 60-GHz wireless communications
- Xiaoxiong Gu
- Dong Gun Kam
- et al.
- 2013
- ECTC 2013
No Clean Flux technology for large die flip chip packages
- Akihiro Horibe
- Kang-Wook Lee
- et al.
- 2013
- ECTC 2013
Power delivery modeling for 3D systems with non-uniform TSV distribution
- Huanyu He
- Zheng Xu
- et al.
- 2013
- ECTC 2013
Electrochemical reactions in solder mask of flip chip-plastic ball grid array package
- Kang-Wook Lee
- Stephane Barbeau
- et al.
- 2013
- ECTC 2013