Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

Featured collections

Popular topics

Year

10 results for Keishi Okamoto

Solder Injected through Via for Multi Stacked Wafers
- - Akihiro Horibe
  - Kuniaki Sueoka
  - et al.
- 2016
- ECTC 2016
Through silicon via process for effective multi-wafer integration
- - Akihiro Horibe
  - Kuniaki Sueoka
  - et al.
- 2015
- ECTC 2015
Effects of in-plane property variations on warpage shapes of organic substrates
- - Sayuri Kohara
  - Keishi Okamoto
  - et al.
- 2019
- EPTC 2019
CFD analysis of molten solder flow behavior and bridging mechanism during solder bump formation
- - Risa Miyazawa
  - Keishi Okamoto
  - et al.
- 2019
- InterPACK 2019
Effects of build-up material properties on warpage dispersion of organic substrates caused by manufacturing variations
- - Keishi Okamoto
  - Sayuri Kohara
  - et al.
- 2017
- InterPACK 2017
The mechanism of the low-k stress reduction in chip assembly by shorter solder bump height
- - Keiji Matsumoto
  - Keishi Okamoto
  - et al.
- 2017
- InterPACK 2017
Advanced interconnect technologies in the era of cognitive computing
- - Yasumitsu Orii
  - Akihiro Horibe
  - et al.
- 2016
- Pan Pacific 2016
Warpage analysis of organic substrates for 2.1D packaging
- - Sayuri Kohara
  - Keishi Okamoto
  - et al.
- 2015
- 3DIC 2015
Effects of low CTE materials on thermal deformation of organic substrates in flip chip package application
- - Hiroyuki Mori
  - Sayuri Kohara
  - et al.
- 2015
- InterPACK 2015
Warpage modeling technique of organic interposer considering deformation by insulator material shrinkage
- - Keishi Okamoto
  - Sayuri Kohara
  - et al.
- 2015
- ICEP-IAAC 2015