Publication
IRPS 2021
Conference paper

TDDB Reliability in Gate-All-Around Nanosheet

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Abstract

Time dependent dielectric breakdown (TDDB) reliability is studied on interfacial layer (IL)/high-K gate stack of Gate-All-Around Nanosheet (GAA-NS) N-and P-type Field Effect Transistors (FETs) with volume-less multiple threshold voltage (multi-Vt) integration scheme enabled by the dual dipoles (n-dipole and p-dipole). We report for the first time Key TDDB Modeling parameters: voltage acceleration exponent (VAE), Weibull slope (β), and activation energy (Ea) and show robust TDDB reliability in multi-Vt NS transistors enabled by different dipoles.

Date

01 Mar 2021

Publication

IRPS 2021

Authors

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