Electrical assessment of chip to chip connection for ultra high density organic interposer

Abstract

Organic interposer which utilize existing manufacturing infrastructure and material, has capability and potential to be in low cost. Furthermore, organic material property which has lower relative dielectric constant (Dk) than silicon dioxide (SiO2) potentially realizes higher bandwidth, keeping particular characteristic impedance on transmission line. In this paper, we focus on a simple chip-to-chip connection with ultra high density circuitry on an organic interposer to make more understanding of relation between trace width and bandwidth. The results show that the bandwidth with assumed organic material is comparable to or more than that with SiO2, and the trace width to obtain bandwidth peak is around 1μm- 2μm.