Conference paper
Soft x-ray diffraction of striated muscle
S.F. Fan, W.B. Yun, et al.
Proceedings of SPIE 1989
A cost effective 28 nm CMOS Interconnect technology is presented for 28 nm node high performance and low power applications. Full entitlement of ultra low-k (ULK) inter-level dielectric is enabled. Copper wiring levels can be combined up to a total of 11 levels. The inter-level dielectric was optimized for low k-value and high strength. The feature profiles were optimized to enable defect-free metallization using conventional tools and processes. High yields and robust reliability were demonstrated. © 2011 Elsevier B.V. All rights reserved.
S.F. Fan, W.B. Yun, et al.
Proceedings of SPIE 1989
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