Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Year

19 results for C. K. Hu‬

Interconnect scaling challenges, and opportunities to enable system-level performance beyond 30 nm pitch
- - Griselda Bonilla
  - N. Lanzillo
  - et al.
- 2020
- IEDM 2020
Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
- - T. Nogami
  - H. Huang
  - et al.
- 2019
- VLSI Technology 2019
Mechanisms of Electromigration Damage in Cu Interconnects
- - C. K. Hu‬
  - L. Gignac
  - et al.
- 2018
- IEDM 2018
Novel low k Dielectric materials for nano device interconnect technology
- - Son Van Nguyen
  - H. Shobha
  - et al.
- 2020
- VLSI-TSA 2020
In-situ preclean run path impact on selective cobalt cap deposition and electromigration
- - Matthew Shoudy
  - H. Shobha
  - et al.
- 2020
- ASMC 2020
Ru Liner Scaling with ALD TaN Barrier Process for Low Resistance 7 nm Cu Interconnects and beyond
- - Koichi Motoyama
  - O. Van Der Straten
  - et al.
- 2018
- IITC 2018
Future on-chip interconnect metallization and electromigration
- - C. K. Hu‬
  - J. Kelly
  - et al.
- 2018
- IRPS 2018
Experimental study of PVD Cu/CVD Co bilayer dissolution for BEOL Cu interconnect applications
- - X. Sun
  - B. Peethala
  - et al.
- 2017
- ECS Meeting 2017
Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires
- - C. K. Hu‬
  - J. Kelly
  - et al.
- 2017
- IITC 2017
Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
- - C. J. Penny
  - S. Gates
  - et al.
- 2017
- IITC 2017