A Unified TDDB Model for BEOL Dielectrics of Various Structures and Thick FEOL Dielectrics
- Kenji Okada
- Kei Date
- et al.
- 2024
- IEEE Transactions on Electron Devices
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14 results for Craig Child
Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- C. J. Penny
- Koichi Motoyama
- et al.
- 2022
- IEDM 2022
Strategy of Insertion of Merge Features in a Sea of Wires SADP Integration
- James H.-C. Chen
- Terry A. Spooner
- et al.
- 2018
- IITC 2018
Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study
- Nicholas A. Lanzillo
- Oscar D. Restrepo
- et al.
- 2018
- Applied Physics Letters
Segment removal strategy in SAQP for advanced BEOL application
- James H.-C. Chen
- Terry A. Spooner
- et al.
- 2017
- IITC 2017
Planarity considerations in SADP for advanced BEOL patterning
- James H.-C. Chen
- Terry A. Spooner
- et al.
- 2017
- IITC 2017
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering
Optimization of porous ultra low- dielectrics (κ≤ 2.55) for 28nm generation
- D. Kioussis
- E.T. Ryan
- et al.
- 2011
- IITC/MAM 2011
Competitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies
- Rod Augur
- Craig Child
- et al.
- 2010
- ADMETA 2010
CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- E. Huang
- M. Oh
- et al.
- 2009
- ADMETA 2009