Correlation of electromigration lifetime distribution to failure mode in dual Damascene Cu/SiLK interconnects
- L. Gignac
- C.-K. Hu
- et al.
- 2003
- Microelectronic Engineering
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Reduced Cu interface diffusion by CoWP surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Microelectronic Engineering
Towards implementation of a nickel silicide process for CMOS technologies
- C. Lavoie
- F.M. D'Heurle
- et al.
- 2003
- Microelectronic Engineering
Ultrathin HfO2 films grown on silicon by atomic layer deposition for advanced gate dielectrics applications
- E. Gusev
- C. Cabral Jr.
- et al.
- 2003
- Microelectronic Engineering
FMR studies of CrO2 epitaxial thin films
- B.Z. Rameev
- R. Yilgin
- et al.
- 2003
- Microelectronic Engineering
Cantilevers with nano-heaters for thermomechanical storage application
- U. Drechsler
- N. Bürer
- et al.
- 2003
- Microelectronic Engineering
Selective wet-etching of microcontact-printed Cu substrates with control over the etch profile
- M. Geissler
- H. Schmid
- et al.
- 2003
- Microelectronic Engineering
Deep reactive ion etching of silicon and diamond for the fabrication of planar refractive hard X-ray lenses
- B. Nöhammer
- C. David
- et al.
- 2003
- Microelectronic Engineering
Switchable cantilever fabrication for a novel time-of-flight scanning force microscope
- Dong Weon Lee
- Michel Despont
- et al.
- 2003
- Microelectronic Engineering
Carbon nanotubes as potential building blocks for future nanoelectronics
- J. Appenzeller
- R. Martel
- et al.
- 2002
- Microelectronic Engineering