Dominik Metzler

Publications

• Control of Plasma Etch Conditions through Pulsed, Cyclic, and QALE Processes for Advanced Node Applications

  • • Dominik Metzler
  • 2023
  • PESM 2023

• Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling

  • • Chris Penny
    • Koichi Motoyama
    • et al.
  • 2022
  • IEDM 2022

• Etch and Patterning Development for 2nm Node Nanosheet Devices

  • • Eric Miller
    • Indira Seshadri
    • et al.
  • 2022
  • SPIE Advanced Lithography 2022

• First Experimental Demonstration of MRAM Data Scrubbing: 80 Mb MRAM with 40 nm junctions for Last Level Cache Applications

  • • Heng Wu
    • Veenadhar Katragadda
    • et al.
  • 2021
  • IEDM 2021

• Significance of plasma-photoresist interactions for atomic layer etching processes with extreme ultraviolet photoresist

  • • Adam Pranda
    • Kang Yi Lin
    • et al.
  • 2020
  • JVSTA

• Selective atomic layer etching of HfO₂ over silicon by precursor and substrate-dependent selective deposition

  • • Kang Yi Lin
    • Chen Li
    • et al.
  • 2020
  • JVSTA

• Simulation of photoresist defect transfer through subsequent patterning processes

  • • Dominik Metzler
    • Mohamed Oulmane
    • et al.
  • 2020
  • SPIE Advanced Lithography 2020

• Exploration of pillar local CDU improvement options for AI applications

  • • Charlie Liu
    • Hao Tang
    • et al.
  • 2020
  • SPIE Advanced Lithography 2020

• An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines

  • • R. S. Smith
    • E. T. Ryan
    • et al.
  • 2019
  • AIP Advances

• Achieving ultrahigh etching selectivity of SiO₂ over Si₃N₄ and Si in atomic layer etching by exploiting chemistry of complex hydrofluorocarbon precursors

  • • Kang Yi Lin
    • Chen Li
    • et al.
  • 2018
  • JVSTA