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Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked ModulesMukta FarooqArvind Kumaret al.2022ECTC 2022
Surface Energy Characterization for Die-Level Cu Hybrid BondingKatsuyuki SakumaRoy Yuet al.2022ECTC 2022
Copper Content Optimization for Warpage Minimization of Substrates with an Asymmetric Cross-Section by Genetic AlgorithmHiroyuki MoriSayuri Kohara2021ECTC 2021
3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence SystemKatsuyuki SakumaMukta Farooqet al.2021IEEE Transactions on CPMT
D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applicationsKatsuyuki SakumaRoy Yuet al.2024IEDM 2024
A NRZ/PAM4 SST TX in 5nm FinFET CMOS with 3-tap FFE and 0.7pJ/b efficiency at 100 Gb/s PAM4Marcel KosselMatthias Brandliet al.2024ESSERC 2024