Toward higher-radix switches with co-packaged optics for improved network locality in data center and HPC networks [Invited]
- Pavlos Maniotis
- Laurent Schares
- et al.
- 2022
- J. of Opt. Comm. and Netw.
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- Semiconductors
716 results for Semiconductors
Interconnects for DNA, Quantum, In-Memory, and Optical Computing: Insights From a Panel Discussion
- Amlan Ganguly
- Sergi Abadal
- et al.
- 2021
- IEEE Micro
Optics enabled networks and architectures for data center cost and power efficiency
- Marc Taubenblatt
- Pavlos Maniotis
- et al.
- 2021
- J. of Opt. Comm. and Netw.
HPC-Cloud Native Framework for Concurrent Simulation, Analysis and Visualization of CFD Workflows
- Carlos Pena Monferrer
- Robert Manson Sawko
- et al.
- 2021
- Future Generation Computer Systems
Co-package technology platform for low-power and low-cost data centers
- Konstantinos Papatryfonos
- David R. Selviah
- et al.
- 2021
- Applied Sciences
Extension of Cu Interconnects and Considerations for Post-Cu Alternative Metals in Advanced Nodes
- Koichi Motoyama
- 2021
- VLSI Technology 2021
3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- IEEE Transactions on CPMT
Additive Lithography - Organic Monolayer Patterning Coupled with an Area-Selective Deposition
- Rudy Wojtecki
- Jonathan Ma
- et al.
- 2021
- ACS AMI
Predictive Guardbanding: Program-Driven Timing Margin Reduction for GPUs
- Jingwen Leng
- Alper Buyuktosunoglu
- et al.
- 2021
- IEEE TCADIS
Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2021
- IEEE Journal of Microwaves