A Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications
- Aakrati Jain
- Kamal Sikka
- et al.
- 2022
- ECTC 2022
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- AI Hardware
210 results for AI Hardware
Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2022
- ECTC 2022
Deterministic Frequency Boost and Voltage Enhancements on the POWER10TM Processor
- Brian Vanderpool
- Phillip Restle
- et al.
- 2022
- ISSCC 2022
Temperature sensitivity of analog in-memory computing using phase-change memory
- Irem Boybat-Kara
- Benedikt Kersting
- et al.
- 2021
- IEDM 2021
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021
Fully on-chip MAC at 14nm enabled by accurate row-wise programming of PCM-based weights and parallel vector-transport in duration-format
- P. Narayanan
- S. Ambrogio
- et al.
- 2021
- VLSI 2021
A 7nm 4-Core AI Chip with 25.6TFLOPS Hybrid FP8 Training, 102.4TOPS INT4 Inference and Workload-Aware Throttling
- Ankur Agrawal
- Saekyu Lee
- et al.
- 2021
- ISSCC 2021
Prospects for photonic implementations of neuromorphic devices and systems
- Bert J. Offrein
- Jacqueline Geler-Kremer
- et al.
- 2020
- IEDM 2020
On-chip phase change optical matrix multiplication core
- Xuan Li
- Nathan Youngblood
- et al.
- 2020
- IEDM 2020
Precision of synaptic weights programmed in phase-change memory devices for deep learning inference
- S. R. Nandakumar
- Irem Boybat
- et al.
- 2020
- IEDM 2020