Voids-free Die-level Cu/ILD Hybrid bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2023
- ECTC 2023
Publications
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- AI Hardware
221 results for AI Hardware
Gradient descent-based programming of analog in-memory computing cores
- 2022
- IEDM 2022
Deep Compression of Pre-trained Transformer Models
- Naigang Wang
- Chi-Chun Liu
- et al.
- 2022
- NeurIPS 2022
Towards Scaling Difference Target Propagation by Learning Backprop Targets
- Maxence Ernoult
- Fabrice Normandin
- et al.
- 2022
- ICML 2022
A 90.4% Peak Efficiency 48V/1V Three-Level Hybrid Dickson Converter with Gradient Descent Run-Time Optimizer and GaN/Si Hybrid Conversion
- Minxiang Gong
- Xin Zhang
- et al.
- 2022
- VLSI Technology and Circuits 2022
A Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications
- Aakrati Jain
- Kamal Sikka
- et al.
- 2022
- ECTC 2022
Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2022
- ECTC 2022
Deterministic Frequency Boost and Voltage Enhancements on the POWER10TM Processor
- Brian Vanderpool
- Phillip Restle
- et al.
- 2022
- ISSCC 2022
Temperature sensitivity of analog in-memory computing using phase-change memory
- Irem Boybat-Kara
- Benedikt Kersting
- et al.
- 2021
- IEDM 2021
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021