AccShield: a New Trusted Execution Environment with Machine-Learning Accelerators
- Wei Ren
- William Kozlowski
- et al.
- 2023
- DAC 2023
Publications
This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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Popular topics
- AI Hardware
Year
110 results for AI Hardware
RaPiD: AI Accelerator for Ultra-Low Precision Training and Inference
- Swagath Venkataramani
- Vijayalakshmi Srinivasan
- et al.
- 2021
- ISCA 2021
- Topic
Ultra-Low Precision 4-bit Training of Deep Neural Networks
- Xiao Sun
- Naigang Wang
- et al.
- 2020
- NeurIPS 2020
ScaleCom: Scalable Sparsified Gradient Compression for Communication-Efficient Distributed Training
- Chia-Yu Chen
- Jiamin Ni
- et al.
- 2020
- NeurIPS 2020
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- Prabudhya Roy Chowdhury
- Sathya Raghavan
- et al.
- 2023
- ECTC 2023
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- Aakrati Jain
- Sathya Raghavan
- et al.
- 2023
- ECTC 2023
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Duixian Liu
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- Toyohiro Aoki
- Hiroyuki Mori
- et al.
- 2023
- ECTC 2023
Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer
- Atom Watanabe
- Hiroyuki Mori
- et al.
- 2023
- ECTC 2023
Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- Ram Krishna
- Atom Watanabe
- et al.
- 2023
- ECTC 2023
