Pico replication: A high availability framework for middleboxes
- Shriram Rajagopalan
- Dan Williams
- et al.
- 2013
- SoCC 2013
Publications
Compiling machine learning algorithms with systemML
- M. Boehm
- D. Burdick
- et al.
- 2013
- SoCC 2013
jVerbs: Ultra-low latency for data center applications
- Patrick Stuedi
- Bernard Metzler
- et al.
- 2013
- SoCC 2013
Go, server, go! Parallel computing with moving servers
- R. Barber
- Guy Lohman
- et al.
- 2013
- SoCC 2013
High-speed signaling performance of multilevel wiring on glass substrates for 2.5-D integrated circuit and optoelectronic integration
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2013
- ECTC 2013
Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates
- Katsuyuki Sakuma
- Edmund Blackshear
- et al.
- 2013
- ECTC 2013
Thermally enhanced pre-applied underfills for 3D integration
- Akihiro Horibe
- Keishi Okamoto
- et al.
- 2013
- ECTC 2013
NiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50μm pitch in 3D chip stacks
- Bing Dang
- Steven Wright
- et al.
- 2013
- ECTC 2013
Realization of ultra-low power I/O
- Lei Shan
- Timothy Dickson
- et al.
- 2013
- ECTC 2013
Optical packaging of silicon photonic devices for external connection of parallel optical signals
- Yoichi Taira
- Hidetoshi Numata
- 2013
- ECTC 2013