Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- Aakrati Jain
- Kamal Sikka
- et al.
- 2021
- ECTC 2021
Publications
Copper Content Optimization for Warpage Minimization of Substrates with an Asymmetric Cross-Section by Genetic Algorithm
- Hiroyuki Mori
- Sayuri Kohara
- 2021
- ECTC 2021
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021
Gradient-leakage resilient federated learning
- Wenqi Wei
- Ling Liu
- et al.
- 2021
- ICDCS 2021
Fully on-chip MAC at 14nm enabled by accurate row-wise programming of PCM-based weights and parallel vector-transport in duration-format
- P. Narayanan
- S. Ambrogio
- et al.
- 2021
- VLSI 2021
Energy Efficiency Boost in the AI-Infused POWER10 Processor
- Brian Thompto
- Dq Nguyen
- et al.
- 2021
- ISCA 2021
Cost-effective federated learning design
- Bing Luo
- Xiang Li
- et al.
- 2021
- INFOCOM 2021
Integrating Machine Learning Data with Symbolic Knowledge from Collaboration Practices of Curators to Improve Conversational Systems
- 2021
- CHI 2021
Expanding explainability: Towards social transparency in ai systems
- Upol Ehsan
- Q. Vera Liao
- et al.
- 2021
- CHI 2021
Designing ground truth and the social life of labels
- Michael Muller
- Christine T. Wolf
- et al.
- 2021
- CHI 2021