Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Publications
Practical Non-interactive Publicly Verifiable Secret Sharing with Thousands of Parties
- Craig Gentry
- Shai Halevi
- et al.
- 2022
- Eurocrypt 2022
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- Prabudhya Roy Chowdhury
- Katsuyuki Sakuma
- et al.
- 2022
- ECTC 2022
Group Signatures and More from Isogenies and Lattices: Generic, Simple, and Efficient
- Ward Beullens
- Samuel Dobson
- et al.
- 2022
- Eurocrypt 2022
Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
- Frank Libsch
- Hiroyuki Mori
- et al.
- 2022
- ECTC 2022
Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
- Keiji Matsumoto
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Sine Series Approximation of the Mod Function for Bootstrapping of Approximate HE
- Charanjit Jutla
- Nathan Manohar
- 2022
- Eurocrypt 2022
Zero-Knowledge IOPs with Linear-Time Prover and Polylogarithmic-Time Verifier
- Jonathan Bootle
- Alessandro Chiesa
- et al.
- 2022
- Eurocrypt 2022
Towards Learning (Dis)-Similarity of Source Code from Program Contrasts
- Yangruibo Ding
- Luca Buratti
- et al.
- 2022
- ACL 2022
Constrained Multi-Task Learning for Bridging Resolution
- Hideo Kobayashi
- Yufang Hou
- 2022
- ACL 2022