Novel Phased Array Antenna-in-Package Development and Active Module Demonstration for 5G Millimeter-Wave Wireless Communication
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2021
- ECTC 2021
Publications
Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- Kamal Sikka
- Ravi Bonam
- et al.
- 2021
- ECTC 2021
Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
- Katsuyuki Sakuma
- Dishit Parekh
- et al.
- 2021
- ECTC 2021
High Density Multi-Chip Module for Photonic Reservoir Computing
- Jean Benoit Heroux
- Toshiyuki Yamane
- et al.
- 2021
- ECTC 2021
CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration
- Risa Miyazawa
- Chinami Marushima
- et al.
- 2021
- ECTC 2021
Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- Aakrati Jain
- Kamal Sikka
- et al.
- 2021
- ECTC 2021
Copper Content Optimization for Warpage Minimization of Substrates with an Asymmetric Cross-Section by Genetic Algorithm
- Hiroyuki Mori
- Sayuri Kohara
- 2021
- ECTC 2021
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021
Fully on-chip MAC at 14nm enabled by accurate row-wise programming of PCM-based weights and parallel vector-transport in duration-format
- P. Narayanan
- S. Ambrogio
- et al.
- 2021
- VLSI 2021
Energy Efficiency Boost in the AI-Infused POWER10 Processor
- Brian Thompto
- Dq Nguyen
- et al.
- 2021
- ISCA 2021