Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
- Takeshi Nogami
- Oleg Gluschenkov
- et al.
- 2022
- VLSI Technology and Circuits 2022
Publications
An 8-bit 56GS/s 64x Time-Interleaved ADC with Bootstrapped Sampler and Class-AB Buffer in 4nm CMOS
- A. Serdar Yonar
- Pier Andrea Francese
- et al.
- 2022
- VLSI Technology and Circuits 2022
A 72GS/s, 8-bit DAC-based Wireline Transmitter in 4nm FinFET CMOS for 200+Gb/s Serial Links
- Timothy Dickson
- Zeynep Deniz
- et al.
- 2022
- VLSI Technology and Circuits 2022
Reliable Sub-nanosecond MRAM with Double Spin-torque Magnetic Tunnel Junctions
- C. Safranski
- G. Hu
- et al.
- 2022
- VLSI Technology and Circuits 2022
A 90.4% Peak Efficiency 48V/1V Three-Level Hybrid Dickson Converter with Gradient Descent Run-Time Optimizer and GaN/Si Hybrid Conversion
- Minxiang Gong
- Xin Zhang
- et al.
- 2022
- VLSI Technology and Circuits 2022
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2022
- ECTC 2022
Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
- Frank Libsch
- Hiroyuki Mori
- et al.
- 2022
- ECTC 2022
A Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications
- Aakrati Jain
- Kamal Sikka
- et al.
- 2022
- ECTC 2022
Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022