Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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28 results for Dale McHerron

Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- - Katsuyuki Sakuma
  - Griselda Bonilla
  - et al.
- 2023
- ECTC 2023
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- - Qianwen Chen
  - Michael Belyansky
  - et al.
- 2023
- ECTC 2023
Voids-free Die-level Cu/ILD Hybrid bonding
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2023
- ECTC 2023
Surface Energy Characterization for Die-Level Cu Hybrid Bonding
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2022
- ECTC 2022
Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- - Mukta Farooq
  - Arvind Kumar
  - et al.
- 2022
- ECTC 2022
Advanced Arsenic Doped Epitaxial Growth for Source Drain Extension Formation in Scaled FinFET Devices
- - Shogo Mochizuki
  - B. Colombeau
  - et al.
- 2018
- IEDM 2018
Novel Materials and Processes in Replacement Metal Gate for Advanced CMOS Technology
- - Ruqiang Bao
  - Steven Hung
  - et al.
- 2018
- IEDM 2018
Challenges and solutions of FinFET integration in an SRAM cell and a logic circuit for 22 nm node and beyond
- - H. Kawasaki
  - V.S. Basker
  - et al.
- 2009
- IEDM 2009
Extremely thin SOI (ETSOI) CMOS with record low variability for low power system-on-chip applications
- - K. Cheng
  - A. Khakifirooz
  - et al.
- 2009
- IEDM 2009
22 nm technology compatible fully functional 0.1 μm ² 6T-sram cell
- - B. Haran
  - A. Kumar
  - et al.
- 2008
- IEDM 2008