A Scalable Multi-TeraOPS Deep Learning Processor Core for AI Trainina and Inference
- Bruce Fleischer
- Sunil Shukla
- et al.
- 2018
- VLSI Circuits 2018
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63 results for Michael Guillorn
Resistivity of copper interconnects at 28 nm pitch and copper cross-sectional area below 100 nm2
- Adam Pyzyna
- Hsinyu Tsai
- et al.
- 2017
- IITC 2017
DSA patterning options for FinFET formation at 7nm node
- Chi Chun Liu
- Elliott Franke
- et al.
- 2016
- SPIE Advanced Lithography 2016
Advanced in-line optical metrology of sub-10nm structures for gate all around devices (GAA)
- R. Muthinti
- Nicolas Loubet
- et al.
- 2016
- SPIE Advanced Lithography 2016
High chi block copolymer DSA to improve pattern quality for FinFET device fabrication
- Hsinyu Tsai
- Hiroyuki Miyazoe
- et al.
- 2016
- SPIE Advanced Lithography 2016
Performance trade-offs in FinFET and gate-all-around device architectures for 7nm-node and beyond
- Seong-Dong Kim
- Michael Guillorn
- et al.
- 2015
- S3S 2015
Resistivity of copper interconnects beyond the 7 nm node
- Adam Pyzyna
- Robert L. Bruce
- et al.
- 2015
- VLSI Technology 2015
Si nanowire CMOS fabricated with minimal deviation from RMG FinFET technology showing record performance
- Isaac Lauer
- Nicolas Loubet
- et al.
- 2015
- VLSI Technology 2015
Fin formation using graphoepitaxy DSA for FinFET device fabrication
- Chi Chun Liu
- Fee Li Lie
- et al.
- 2015
- SPIE Advanced Lithography 2015
Customization and design of directed self-assembly using hybrid prepatterns
- Joy Y. Cheng
- Gregory S. Doerk
- et al.
- 2015
- SPIE Advanced Lithography 2015