Conference paper
Cu-based bonding technology for 3D integration applications
K.N. Chen, Zheng Xu, et al.
3DIC 2012
A dopant-segregation technique for junction engineering has been demonstrated on trigate transistors using a process flow that does not include raised source/drain epitaxy. It is shown that the dopant-segregation technique reduces the off-state leakage current and improves the on-state performance for NFET devices when compared with control devices built using conventional junction engineering. The dopant-segregation process has no observable impact on PFET device performance. © 1980-2012 IEEE.
K.N. Chen, Zheng Xu, et al.
3DIC 2012
Tuan T. Tran, Lukas Jablonka, et al.
Scientific Reports
Benjamin G. Lee, Alexander V. Rylyakov, et al.
OFC 2013
Benjamin G. Lee, Alexander V. Rylyakov, et al.
Journal of Lightwave Technology